SOP8-DIP8 Adapter OTS-16-03 (150mil)

The   SOP8-DIP8 Adapter OTS-16-03 (150mil)   is a type of adapter or breakout board designed to convert a   SOP-8 (Small Outline Package)   IC into a   DIP-8 (Dual In-line Package)   format. This allows surface-mount SOP-8 chips to be used in breadboards, prototyping boards, or other applications designed for through-hole DIP-8 components.

Key Features:

1. SOP-8 to DIP-8 Conversion: Enables easy integration of SOP-8 ICs into DIP-8 compatible systems.
2. 150mil Pin Spacing: The pin spacing (pitch) is 150 mils (0.15 inches), which is standard for DIP packages.
3. OTS-16-03: Likely refers to the specific model or series of the adapter.
4. Reusable: Can be used multiple times for prototyping or testing different SOP-8 ICs.
5. Compact Design: Small and lightweight, making it suitable for various applications.

Typical Applications:

– Prototyping and testing SOP-8 ICs on breadboards.

– Converting surface-mount components for use in through-hole designs.

– Educational or hobbyist projects where DIP packages are preferred for ease of use.

How to Use:

1. Place the SOP-8 IC into the adapter’s SOP-8 footprint.
2. Solder the IC onto the adapter (if not already pre-soldered).
3. Insert the DIP-8 pins of the adapter into a breadboard or PCB.

Notes:

– Ensure proper alignment of the SOP-8 IC on the adapter before soldering.

– Double-check the pinout of the IC to avoid incorrect connections.