SOP20-DIP20 Adapter OTS-20-1.27-01 (200mil)

The SOP20-DIP20 Adapter OTS-20-1.27-01 (200mil)  is a specialized adapter designed to convert a  SOP20 (Small Outline Package) IC to a DIP20 (Dual In-line Package) format. This adapter is particularly useful for prototyping, testing, or using surface-mount devices (SMD) on breadboards or PCBs designed for through-hole components.

Key Features:

1. Package Conversion:

   – Converts SOP20 (1.27mm pitch) to DIP20 (200mil or 2.54mm pitch).

   – Allows surface-mount SOP20 ICs to be used in DIP20 sockets or breadboards.

2. Pitch:

   – SOP20 side: 1.27mm pitch (standard for SOP packages).

   – DIP20 side: 200mil (2.54mm pitch, standard for DIP packages).

3. Pin Count:

   – 20 pins on both SOP and DIP sides.

4. Material:

   – Typically made of high-quality PCB material with plated through-holes for reliable connections.

5. Applications:

   – Prototyping and testing SOP20 ICs on breadboards.

   – Adapting SOP20 ICs for use in DIP20 sockets.

   – Simplifying the integration of surface-mount components into through-hole designs.

6. Dimensions:

   – The adapter is compact and designed to match the footprint of a standard DIP20 package.

Usage:

– Place the SOP20 IC onto the adapter’s SOP20 footprint.

– Solder the IC to the adapter using a fine-tip soldering iron.

– Insert the DIP20 side of the adapter into a breadboard, socket, or PCB.

Benefits:

– Enables the use of modern surface-mount components in legacy through-hole designs.

– Simplifies testing and prototyping without requiring custom PCBs.

– Cost-effective solution for adapting SOP20 ICs to DIP20 formats.

Common Applications:

– Electronics prototyping and development.

– Educational projects and experiments.

– Repairing or upgrading older electronics with modern components.