IC Chip Extractor Rework Station Clip Tool

350.00 {Inc. GST}

GST Input Tax Credit is available

Dispatch Time 15 TO 20 Days

Available on backorder

SKU: OMP-AD119 Category:

Description

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125?±5? x 24 hours or 80?±5? x 48 hours

Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245?-260?(Maximun)

Leaded/Pb BGA chips:

180?-205?(Maximun)

Additional information

Weight 50 g

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