BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125?±5? x 24 hours or 80?±5? x 48 hours
Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
Leaded/Pb BGA chips: