ZQT-90X Magnet BGA Reballing Station | 80–90mm Automatic Magnetic Stencil Holder

BGA Chipset – Important Handling Precautions

BGA chipsets are moisture-sensitive devices and must be handled carefully to prevent damage during soldering or reflow. Before mounting, the chipset must be baked to remove absorbed moisture.

Baking Process

To prepare the BGA chip prior to installation:

1. Place the sealed moisture barrier bag (MBB) on a baking tray.

2. Insert the tray into a dry cabinet or baking oven.

3. Set the baking parameters as follows:

   • 125℃ ±5℃ for 24 hours, or

   • 80℃ ±5℃ for 48 hours

This prevents “popcorning,” cracking, or internal damage during reflow.

Important: Identify Ball Type Before Reflow

Always check whether the BGA chipset uses Leaded (Pb) balls or Lead-Free (No Pb) balls, as their reflow temperature requirements are different.

Lead-Free (No Pb) BGA Chips

• Recommended Reflow Temperature: 245℃–260℃ (Maximum)

Leaded (Pb) BGA Chips

• Recommended Reflow Temperature: 180℃–205℃ (Maximum)

Correct temperature selection ensures proper soldering and prevents thermal damage.