EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 Series Socket 3in1 Data Recovery Programming and Test Chips

Description

Feature:

1. Compatibility:
   • Works with eMCP and eMMC from major brands: Samsung, Sandisk, Toshiba, Hynix, Micron, MTK, and Intel.
   • Compatible with various BGA types: 153, 169, 162, 186, and 221. (Socket change required)
2. Ease of Use:
   • Simple operation by plugging the USB into a PC.
3. Versatile Testing Solution:
   • Compact testing solution for eMMC and eMCP, suitable for mobile, data recorder, IoT, etc.
4. Applications:
   • Test, debug, validate, and program eMMC and eMCP devices.
   • Conduct failure analysis, system, and wafer tests.
   • Qualify packages and chips.
   • Produce prototypes and recover data.

Specification:

• Type:
  • Test sockets for BGA153/169, BGA162/186, and BGA221 (with USB interface).
• Pin Count:
  • BGA153/169: 30 pins
  • BGA162/186: 17 pins
  • BGA221: 36 pins
• Pin Pitch: 0.5mm
• Applicable IC Size:
  • 11.5x13mm, 12x16mm, 12x18mm, 14x18mm
• Life Span: 25,000 insertions.

Package Including:

• 1 BGA153/169 socket
• 1 BGA162/186 socket
• 1 BGA221 socket
• 1 PCB test board with USB
• 4 border limiters (11.5x13mm, 12x16mm, 12x18mm, 14x18mm)

Additional Software:

• Simple software provided for capacity check, read, write, and verify functionalities. Contact via email for access.