EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 Series Socket 3in1 Data Recovery Programming and Test Chips

28000.00 {Inc. GST}

GST Input Tax Credit is available

Dispatch Time 12 to 15 days

Available on backorder

SKU: OMP-AD249 Category:

Description

Feature:

  1. Compatibility:
    • Works with eMCP and eMMC from major brands: Samsung, Sandisk, Toshiba, Hynix, Micron, MTK, and Intel.
    • Compatible with various BGA types: 153, 169, 162, 186, and 221. (Socket change required)
  2. Ease of Use:
    • Simple operation by plugging the USB into a PC.
  3. Versatile Testing Solution:
    • Compact testing solution for eMMC and eMCP, suitable for mobile, data recorder, IoT, etc.
  4. Applications:
    • Test, debug, validate, and program eMMC and eMCP devices.
    • Conduct failure analysis, system, and wafer tests.
    • Qualify packages and chips.
    • Produce prototypes and recover data.

Specification:

  • Type:
    • Test sockets for BGA153/169, BGA162/186, and BGA221 (with USB interface).
  • Pin Count:
    • BGA153/169: 30 pins
    • BGA162/186: 17 pins
    • BGA221: 36 pins
  • Pin Pitch: 0.5mm
  • Applicable IC Size:
    • 11.5x13mm, 12x16mm, 12x18mm, 14x18mm
  • Life Span: 25,000 insertions.

Package Including:

  • 1 BGA153/169 socket
  • 1 BGA162/186 socket
  • 1 BGA221 socket
  • 1 PCB test board with USB
  • 4 border limiters (11.5x13mm, 12x16mm, 12x18mm, 14x18mm)

Additional Software:

  • Simple software provided for capacity check, read, write, and verify functionalities. Contact via email for access.

Additional information

Weight 250 g

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