BGA63-DIP48-0.8mm Adapter For XGecu T56 Programmer

The BGA (Ball Grid Array) package is a type of surface-mount packaging used for integrated circuits. It’s characterized by an array of solder balls arranged in a grid on the underside of the IC.

The DIP48 (Dual In-line Package) refers to the format of the adapter, which allows the BGA IC to be plugged into a socket with 48 pins arranged in two rows.

The 0.8mm specification likely refers to the pitch of the solder balls on the BGA package, indicating the distance between the centers of adjacent solder balls. This information is crucial because it ensures compatibility between the adapter and the specific BGA IC being programmed.

The XGecu T56 programmer is likely a device used for programming various types of ICs, including those with BGA packages. The adapter serves as an interface between the programmer and the BGA IC, allowing for proper connection and programming.

Overall, this adapter enables the XGecu T56 programmer to support BGA63-packaged ICs, expanding its capabilities to work with a broader range of integrated circuits.